Package Reverse Engineering Highlights
The main features electrical, materials characterization tools to analyse reverse electronic packaging level.
The main features electrical, materials characterization tools to analyse reverse electronic packaging level.
Visual Examination
3D Optical Examination
Energy Dispersive X-Ray Spectrometry
Scanning Electron Microscope Imaging SEM
Backscatter Imaging BSE
Confocal Imaging
Acoustic Microscopy
Delid and Decap
Leak Detection
X-Ray Radiography
Mechanical Cross Sectional
Focused Ion Beam
Ion Milling
Shear and Wire Pull Strength
Shear strength of an adhesive that is applied to two metal plates and pulled to failure thus determine the adhesive strength.
Wire Pull, bond pull testing, to determine wire bond strength and quality. It consists of applying an upward force under the wire to be tested, effectively pulling the wire away from the die.