Electronic Package Level Highlights
The die level analysis ultimate goal in failure analysis is to arrive at an accurate determination of the cause of failure.
The main features electrical, materials characterization tools to analyse electronic packaging level.
Visual Examination
3D Optical Examination
Infrared Imaging
Infrared Thermal Imaging
Scanning Electron Microscope Imaging SEM
Backscatter Imaging BSE
Confocal Imaging
Acoustic Microscopy
Delid and Decap
Leak Detection
X-Ray Radiography
Electrical Verification
Thermal isolation
Signal Tracing
Optical Beam Induced Current
Materials Characterization
Auger Electron Spectroscopy
Energy Dispersive X-Ray Spectrometry
Shear and Wire Pull Strength
Shear strength of an adhesive that is applied to two metal plates and pulled to failure thus determine the adhesive strength.
Wire Pull, bond pull testing, to determine wire bond strength and quality. It consists of applying an upward force under the wire to be tested, effectively pulling the wire away from the die.
Physical Characterization
Cross-Sectional
Focused Ion Beam
Ion Milling