Electronic Die Level Highlights
The Integrated chip die level analysis ultimate goal in failure analysis is to arrive at an accurate determination of the cause of failure.
The main features imaging, electrical ,materials characterization tools to analyse the integrated chip.
Imaging Verification
Optical Examination
3D Optical Examination
Infrared Imaging
Infrared Thermal Imaging
Scanning Electron Microscope Imaging SEM
Backscatter Imaging BSE
AFM imaging
Confocal Imaging
Electrical Verification
Signal Tracing
Soft Defect Localization
Thermal isolation
Optical Beam Induced Current
Resistive Contrast Imaging
Light Emission
Light Induced Voltage Alteration
Materials Characterization
Auger Electron Spectroscopy
Energy Dispersive X-Ray Spectrometry
Shear and Wire Pull Strength
Shear strength of an adhesive that is applied to two metal plates and pulled to failure thus determine the adhesive strength.
Wire Pull, bond pull testing, to determine wire bond strength and quality. It consists of applying an upward force under the wire to be tested, effectively pulling the wire away from the die.
Physical Characterization
Mechanical Cross Sectional
Focused Ion Beam
Ion Milling